Mask Etcher® systems

Plasma-Therm has pioneered dry etching for the highly specialized photomask market for more than 15 years. Mask Etcher® systems set dry etch performance and flexibility standards for photomask production. Plasma-Therm’s Mask Etcher® solution is a key enabler of Moore’s law and shrinking technology nodes. A wide variety of films can be etched from entry level 250um technology to < 32nm production with ICP high density plasma etch systems. Excellent uniformity and particle control are achieved through innovative technologies while maintaining high system production uptime. Plasma-Therm’s latest Generation V Mask Etcher excels in CD uniformity and linearity well below 5 nm. Mask Etcher 2-V Evolution Mask Etcher® Gen 2 Gen 3 Gen 4 GenV Node (nm) 180 130-90 65-45 32-22

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