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Plasma-Therm’s new MicroDieSingulator is the first volume-production-ready Plasma Singulator in the industry. It delivers unique benefits, especially for thin and ultra-thin wafers. • Unmatched smooth sidewalls • No lateral damage • Improved die strength over incumbent dicing techniques • Capable of reducing street size to less than 10µm • Capable of processing wafers less than 50µm thick • Enables singulation of non-rectangular dies (e.g. rounded corners, key shape)